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SMT Placement Machine Patch Quality Analysis

Edit:Shenzhen ETON Automation Equipment Co.,LtdUpDate:Apr 17, 2018

The main factors that lead to patch leakage

1.1 The feeder of the component feeder is not in place.

1.2 The gas path of the component suction nozzle is blocked, the suction nozzle is damaged, and the height of the suction nozzle is incorrect.

1.3 The vacuum circuit of the equipment is faulty and clogging occurs.

1.4 The board is defective and deformed.

1.5 There is no solder paste or too little solder paste on the pad of the board.

1.6 The quality of components and components is inconsistent with the thickness of the same product.

1.7 There is a mistake in the calling procedure of the mounter, or there is an error in the selection of the thickness parameters of the components during programming.

1.8 Human factors accidentally touched.


The main factors that cause SMC resistors to turn over and side parts

2.1 The feeder of the component feeder is abnormal.

2.2 The nozzle height of the mounting head is incorrect.

2.3 The height of the picking head is wrong.

2.4 The size of the filling hole of the component tape is too large, and the components are flipped due to vibration.

2.5 When the bulk material is placed in the tape, the direction is reversed.


The main factors that lead to component placement

3.1 When the placement machine is programmed, the X-Y axis coordinates of the components are incorrect.

3.2 Smear suction nozzle causes unstable suction.


Main factors that cause damage when components are mounted

4.1 Positioning the ejector pin is too high and the position of the circuit board is too high. The component is squeezed when it is mounted.

4.2 When the mounter is programmed, the Z-axis coordinates of the components are incorrect.

4.3 The nozzle spring of the mounting head is stuck.